SMART SYSTEMS INTEGRATION - die internationale Kommunikationsplattform für Industrie und Forschungsinstitute dient dem Wissenstransfer zum Thema Smart Systems Integration. Die Veranstaltung schafft die Basis für erfolgreiche Forschungskooperationen mit Schwerpunkt Europa.

Die Veranstaltung ist Teil der Aktivitäten von EPoSS, European Technology Platform on Smart Systems Integration.

Technologie - Kleiner! Komplexer! Intelligenter!

Durch Smart Systems Integration entsteht aus verschiedenen Einzelkomponenten ein System, das über Sensorik Informationen aus der Umwelt gewinnt, diese mittels Elektronik verarbeitet, Signale und Daten kommuniziert und aktive Rückmeldung an die Umgebung leisten kann.
Zunehmende Komplexität und Interdisziplinarität stellen höchste Ansprüche an die Entwicklerteams, die sich auf den Gebieten Mikrosystem- und Nanotechnik, Optik, Fluidik, Biologie, Medizin, Elektronik und kabellose Kommunikationstechnik bewegen müssen.

SMART SYSTEMS INTEGRATION is the international communication platform for research institutes and manufacturer to exchange know-how on smart systems integration and to create the basis for successful research co operations with focus on Europe.

The event is part of the activities of EPoSS, the European Technology Platform on Smart Systems Integration.

Technology - Smaller! Smarter! Integrated!

Smart Systems Integration allows you to form a system out of components which is able to gain information from the environment, to process it electronically, to communicate signals and data and to give enabled feedback signal to the ambience.
The whole system is subject to the trend of today’s world: miniaturization, networking capability, energy-autonomy and reliability. Due to increasing complexity and multidisciplinarity developing teams in fields of microsystems- and nanotechnology, optics, fluidics, biology, medical science, electronics and wireless communication technologies face highest demands.

Scope of the conference

The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modelling, simulation and characterisation of advanced nanoscale silicon and silicon compatible devices in the More Moore, More than Moore and Beyond CMOS domains. Topics  include, but are not limited to:

• Nanometre scale devices: physics, technology, characterisation techniques and evaluation metrics for high performance, low power, low standby power, high frequency and memory applications.
• CMOS scaling perspectives; device / circuit level performance evaluation; switches and memory scaling.
• New channel materials for CMOS electronics: strained Si,  strained SOI, SiGe,  GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devices.
• Thin gate dielectrics: first and second generation high-k materials for switches and memory.
• Alternative transistor architectures including PDSOI, FDSOI, DGSOI, FinFETs, MuGFETs, vertical MOSFET, IMOS and tunnel FET structures. Benchmarking of new architectures w.r.t. bulk CMOS.
• One dimensional and zero dimensional structures: nanowires, nanotubes, nanodots. Nanowire and nanotube based interconnects; nanocrystal based NVM memory cells.
• Variability and fluctuation phenomena in electronic switches and memory devices. Single electron, few electron, discrete dopant and discrete charge effects in scaled electron devices.
• Advanced physics based modelling and simulation of nanoscale switches and memory. First principle and ab-initio modelling of devices, materials and interfaces for CMOS.
• Quasi ballistic, ballistic and quantum transport in nanoscale devices. Compact modelling of nanoscale devices. modelling and management of thermal effects. Benchmarking of modelling approaches.
• Process characterisation through device parameter extraction, device and electrical characterisation of nanometre scale technologies.
• CMOS compatible molecular and quantum devices; non conventional nanodevices for sensors, actuators and bioelectronics. NanoCMOS to bio- and opto-interfaces.

Image Sensors Europe 2010
23 - 25 March 2010
Copthorne Tara Hotel, Kensington, London, UK

Microelectronic Presentation Days (03-04/2010) - ESTEC

Preliminary Agenda

Attend SPIE Photonics Europe, a conference focused on a broad range of technologies and their integration into a variety of applications. Broaden your professional network and accelerate your research.

Hear the latest updates in

• Micro/Nano Technologies
• Disruptive Organic and Bio Photonics
• Highly Integrated and Functional Photonic Components
• Advances in Laser and Amplifier Technologies
• Photonics in Industrial Applications

2010 Programme

• 19 Conferences
  Hear the latest from 1,300 presentations
  
  
• Hot Topics in Photonics
  
  • European photonics research strategy
  • optical nanoscopy
  • micromanipulation
  • photonics and computing
  • photonic integration
  • nanophotonics
  • plastic photonics and electronics
  • ultrafast nonlinear optics
  
  
  
• Courses and Workshops
  In-depth training and career enhancement
  
  
• 150-Company Exhibition
  Meet new suppliers from leading companies. Registration for the exhibition is free.
  
  
• Photonics Innovation Village
  Showcasing developments from universities, nonprofits, and research centres

5th Fraunhofer IMS Workshop
CMOS Imaging
Low-Light Imaging

May 4th and 5th, 2010

at Fraunhofer IMS
Finkenstraße 61
47057 Duisburg / Germany

Objectives and Scope
The past CMOS Imaging Workshops were a great success
and were met with very high interest. We want to
continue providing a forum to the European industry and
academia for important themes on technology, design,
and applications of CMOS-based image sensors and
systems as well as facilitate discussions on related topics.

Language
The official language of the workshop is English.

Speakers
We have the pleasure to announce well-known invited
speakers who give comprehensive surveys and interesting
talks on their special fields of interest.

Anton Grabmaier, Fraunhofer IMS, Germany

Holger Vogt, Fraunhofer IMS, Germany

Lindsay Grant, STM, Great Britain

Mark Stanford Robbins, e2v, Great Britain

Franco Zappa, Politecnico di Milano, Italy

Gerhard Lutz, PNSensor, Germany

Albert Theuwissen, Harvest Imaging & Technical University of Delft, The Netherlands

Pierre Magnan, SUPAERO, France

Boyd Fowler, Fairchild Imaging, U.S.A.

Alex Krymski, Alexima, U.S.A.

Guy Meynants, CMOSIS, Belgium

Walter Rütten, Philips, Germany

Werner Brockherde, Fraunhofer IMS, Germany

Ulrich Seger, Robert Bosch, Germany

Sören Hader, Pilz, Germany

Workshop Documentation
A CD-ROM with the contents of the presentations
will be handed out to the participants of the workshop.

Organization
This workshop is organized by the Fraunhofer Institute
of Microelectronic Circuits and Systems, Duisburg,
Germany. The members of the Program Committee are
Prof. Bedrich Hosticka, Ph.D., and Mr. Werner
Brockherde. Workshop secretary is Mrs. Cornelia Metz.

Workshop Venue
The workshop will be held at the Fraunhofer Institute
in Duisburg. The institute is located downtown Duisburg
and can be easily reached either from Duisburg Central
Railway Station or from Duesseldorf International Airport.

Evening Event on May 4th, 2010
A dinner is going to take place at the “Residenz
Uhlenhorst” which is an old historic villa of an industrialist
of the 20th century. The location is situated in the
forest of Mülheim/Ruhr near to the Fraunhofer Institute.

Nürnberg, 18. - 20.5.2010
17. Internationale Fachmesse für Sensorik, Mess- und Prüftechnik mit begleitenden Kongressen

Nach oben

Mehr als 20.000 Wissenschaftsbegeisterte aller Altersgruppen strömten am 19. Juni 2009 zum siebten Mal sieben Stunden lang in die Dresdner Hochschulen und Forschungsstätten und flanierten durch Labore und Hörsäle. Und sorgten damit für einen weiteren Besucherrekord. Egal ob Leibniz-, Max-Planck- oder Fraunhofer-Institute, TU Dresden, HTW, Musikhochschule oder Universitätsklinikum – bei allen 29 Veranstaltern der Wissenschaftsnacht zeigte sich in rund 370 Veranstaltungen an 44 verschiedenen Orten das ungebrochene Wissenschaftsinteresse. Schon die kleinsten Besucher im Vorschulalter fragten, staunten und lernten, was in Laboren zischt und getüftelt und in Hörsälen dargeboten wird.

Detectors and Imaging Devices:
OP217: Infrared Detectors and Focal Plane Arrays XI
Chair(s): Eustace L. Dereniak; John P. Hartke; Paul D. LeVan
Program Committee
Arvind I. D'Souza, DRS Sensors & Targeting Systems, Inc.; Sarath D. Gunapala, Jet Propulsion Lab.; John E. Hubbs, Ball Aerospace & Technologies Corp.; Herbert K. Pollehn, Army Research Lab.; Robert E. Sampson, I-Technology Applications; James A. Stobie, BAE Systems; William B. Weissbard, Teledyne Imaging Sensors

This conference is to cover 2-D Arrays from the visible (NIR) to the longwave infrared spectrum (LWIR). The detection of infrared radiation has proven to be a viable investigative tool in environmental studies and in medical, automotive, and military applications. This conference is directed toward the focal plane component of the infrared sensor system. Progress in charge transfer device technology has been rapid in both linear and two-dimensional arrays, thus continual updates to the optics community are needed. Recent developments in room temperature infrared detectors and system applications have resulted in significant interest in these topics. Various architectures such as monolithic, planar hybrid, and signal conditioning technology have been demonstrated at cryogenic temperatures for higher performance cooled IR FPAs, and therefore are tools available to researchers in various disciplines. Applications of systems containing these technologies are becoming more common, and techniques for extending the utility of these are solicited.

This conference will provide a forum for papers ranging from basic device physics to novel applications. Also there will be sessions featuring Focal Plane Signal Processing Electronics and Readout Electronics, and associated circuitry. Some sessions will emphasize Smart Signal Processing within the Readout Integrated Circuit (ROIC). We are looking for papers that demonstrate state-of-the-art in novel readout structures, on-chip signal processing, and papers that will provide information on newly designed, less expensive digital circuits for fast and ultra fast signal processors on the focal plane array.

Papers are solicited in, but are not limited to, the following areas:
    * infrared detector materials (i.e., InSb, HgCdTe, PtSi, GaAs)
    * infrared FPA (and detector) testing
    * quantum structure detectors (e.g., QWIP, stained layer)
    * smart focal planes
    * diffractive optics on FPA
    * planar hybrid arrays
    * hybrid input circuits
    * infrared sensor systems and characteristics
    * astronomical applications
    * industrial applications
    * automotive applications
    * medical applications
    * imaging spectrometer application
    * imaging polarimeter application
    * FPA data processing
    * cryogenic electronics
    * on-FPA signal processing
    * room temperature detectors
    * ROIC designs
    * smart signal processing
    * readout electronics
    * S/H on-chip
    * A/D converters per pixel, column, and array
    * up/down counter on FPA.

OP218: Infrared Detector Devices and Photoelectronic Imagers V
Chair(s): Randolph E. Longshore; Ashok K. Sood
Program Committee
Raymond S. Balcerak, Raymond S. Balcerak, LLC; Nibir K. Dhar, Army Research Lab.; Paul LoVecchio, BAE Systems; Meimei Z. Tidrow, U.S. Army Night Vision & Electronic Sensors Directorate; Priyalal S. Wijewarnasuriya, Army Research Lab.; Jimmy Xu, Brown Univ.; Sung-Shik Yoo, Northrop Grumman Electronic Systems

This conference will focus on technology achievements in the EO/IR and Photoelectronic detection and imaging and Nanotechnology based EO/IR devices and technology. The various demands for high sensitivity, low noise, improved resolution, higher low-light-level sensitivity, high-speed response, laser eye-safe imaging, and solar blind UV detector arrays, etc., have produced extensive research and development activities for devices and systems to be used for tactical, space science, analytical instrumentation, military, medical, and a host of other applications.

In addition, the conference is intended as a high-level forum bringing together scientists and engineers involved in the research, design, and development of infrared detectors and unique IR device structures including nanotechnology.

Papers are solicited for, but not limited to, the following topics:
    * nano technology based EO/IR detectors
    * nano / micro bolometers
    * detectors on large area substrates
    * HgCdTe on silicon
    * SWIR,MWIR,LWIR detectors
    * quantum well FPAs
    * heterojunction FPAs
    * strained superlattice FPAs
    * type II antimony-based superlattices FPAs
    * commercial applications
    * higher operating temperature detectors
    * avalanche photodiodes
    * very long-wavelength detectors
    * electronic readout image intensifier devices
    * innovative low noise read out circuits
    * CMOS / CCD cameras
    * single and multi-MCP detectors and imagers
    * microchannel plate technology improvements for image intensifiers
    * high-performance photomultiplier tubes
    * advanced microchannel plates
    * advanced fiber optics
    * solar blind imaging systems
    * medical image tube cameras
    * cameras for low-light-level high-definition TV
    * ultraviolet imaging systems
    * photon-counting imaging
    * lidar and ladar imaging
    * image intensifiers for military night vision systems
    * plasmonic IR applications
    * robotic vision
    * unmanned autonomous vehicle cameras
    * undersea imaging.
    * multi spectral systems

Die 10. OPTATEC empfängt die Fachwelt vom 15. bis 18. Juni 2010 in Frankfurt mit einem deutlich überarbeiteten Angebotsspektrum sowie der speziellen Präsentation von aktuellen / künftigen Brennpunkten der Branche.

524 ausstellende Unternehmen aus 28 Ländern, mehr als 5.500 Fachbesucher – die im Jahr 2008 veranstaltete OPTATEC, Internationale Fachmesse Optischer Technologien, Komponenten, Systeme und Fertigung für die Zukunft, wurde ihrem Ruf als Branchen-Treff mit weltweiter Beteiligung und Beachtung erneut mehr als gerecht. Der einmalige Mix aus anforderungsgerechter Nomenklatur, praxisnaher Branchen-Orientierung sowie international anerkannter Informations-, Kommunikations- und Beschaffungs-Plattform für die Hard- und Software bei der Anwendung Optischer Technologien, wird auch zur 10. OPTATEC vom 15. – 18. Juni 2010 die internationale Fachwelt im Messezentrum Frankfurt zusammenführen.

Die Schlüsseltechnologie der Zukunft präsentiert sich auf der
OPTATEC 2010 – Ausstellungsflächen sind stark gefragt

Knapp 70% der letztmals benötigten Ausstellungsfläche war zum Jahresbeginn 2009 bereits wieder belegt. Dieser Trend wird sich mit Sicherheit fortsetzen, denn die Entwicklung Optischer Technologien schreitet rasant voran und ermöglicht jetzt und in der Zukunft vielfältige Anwendungen in bisher ungeahntem Ausmaß. Für die meisten Optik-, Energie-, Medizin- und Fertigungstechnik-Prozesse nehmen optische Technologien zweifellos eine Schlüsselfunktion ein.

 Mit der Jubiläums-OPTATEC für die Zukunft der Branche gerüstet 

Um die Rolle der OPTATEC als eine führende Branchenplattform auch künftig zu sichern, werden alle Aspekte, Technologien, Produkte, Systeme und Dienstleistungen rund um die optischen Technologien in allen relevanten Bereichen dem technischen Fortschritt angepasst. Bewährtes bleibt erhalten, neue Branchenentwicklungen werden angemessen integriert. 2010 liegt der Fokus auf den Trendthemen Faseroptik, Photovoltaik, Sicherheitstechnik, LED-Technik und Medizintechnik. Ein attraktives Rahmenprogramm vervollständigt die Präsentation.

AMICSA 2010 (5-8 September 2010)

ESA is organizing the Third International Workshop on Analog and Mixed-Signal Integrated Circuits for Space Applications (AMICSA).

The Workshop will be held from September 5 to September 7 in ESTEC, The Netherlands.

This 3rd edition will include tutorials on mixed signal design for space.

Toulouse, France 20 - 23.09 2010
Centre de Congrès Pierre Baudis

SPIE Remote Sensing is the premier European meeting focused on the latest developments in remote sensing, including next-generation satellites, SAR image analysis, and LIDAR technologies.

Nach oben

Cologne Germany 21.9. - 26.9.2010
Koelnmesse
world of imaging
Die Weltleitmesse für Foto und Imaging

Held at the Parc Floral on the Esplanade du Château Vincennes in Paris, PRI - PHOTON Research Industry 2010 is the event where you will meet optics photonics leaders, forge new relationships and build your business.

This year, PRI unites OPTO (October 26-28, 2010), the European tradeshow dedicated to all optics-photonics solutions, with the annual meetings of the European Optical Société (EOS) and the CNOP (National Committee on Optics and Photonics) as well as special activities including the celebration of the laser's 50th anniversary and the awards ceremony for La Vitrine de l'Innovation.

The 7th China International Machine Vision Exhibition and Machine Vision Technology & Application Conference (VisionChina2010) will be held on October 27-29, 2010 at China International Exhibition Center, Beijing, China. Jointly organized by Machine Vision Professional Committee under China Society of Image and Graphics and CIEC Exhibition Co., Ltd., VisionChina2010 will serve as an efficient platform for showcasing latest machine vision products and technology as well as conducting trade exchanges.

Around 100 exhibiting companies from 9 countries and regions participated in VisionChina2009, namely the United States, Germany, Japan, Singapore, Korea, Malaysia, Finland, China and Hong Kong SAR of China. The exhibiting space reached 3500 square meters. 726 registered professionals and end-users attended the conference in 21 sessions. The three-day exhibition attracted 6342 trade visitors from China, Hong Kong, Taiwan, the United States, Korea, Japan, Australia, German, Singapore, Thailand, India，Israel and Lebanon etc.

Stuttgart 09.11. - 11.11.2010
Internationale Fachmesse für industrielle Bildverarbeitung und Identifikationstechnologien

2011 International Image Sensor Workshop (IISW)
Japan June 2011

General Workshop Co-Chairs:

Nobakazu Teranishi / Panasonic

Junichi Nakamura / Aptina Imaging

Technical Program Chair:
Shoji Kawahito / Shizuoka University

Steering Committee:

Eric R. Fossum / Samsung Semiconductor R&D Center

Nobukazu Teranishi / Panasonic

Albert Theuwissen / Harvest Imaging & Delft Univ. of Technology