San Jose, California, USA  17 - 21  Januray 2010

The best global audience for imaging systems, instrumentation, 3D, and image processing

 

Wednesday: Image Sensors

Thursday: High Speed Image Capture Technologies

Microelectronic Presentation Days (03-04/2010) - ESTEC

Preliminary Agenda

SMART SYSTEMS INTEGRATION - die internationale Kommunikationsplattform für Industrie und Forschungsinstitute dient dem Wissenstransfer zum Thema Smart Systems Integration. Die Veranstaltung schafft die Basis für erfolgreiche Forschungskooperationen mit Schwerpunkt Europa.

Die Veranstaltung ist Teil der Aktivitäten von EPoSS, European Technology Platform on Smart Systems Integration.

Technologie - Kleiner! Komplexer! Intelligenter!

Durch Smart Systems Integration entsteht aus verschiedenen Einzelkomponenten ein System, das über Sensorik Informationen aus der Umwelt gewinnt, diese mittels Elektronik verarbeitet, Signale und Daten kommuniziert und aktive Rückmeldung an die Umgebung leisten kann.
Zunehmende Komplexität und Interdisziplinarität stellen höchste Ansprüche an die Entwicklerteams, die sich auf den Gebieten Mikrosystem- und Nanotechnik, Optik, Fluidik, Biologie, Medizin, Elektronik und kabellose Kommunikationstechnik bewegen müssen.

SMART SYSTEMS INTEGRATION is the international communication platform for research institutes and manufacturer to exchange know-how on smart systems integration and to create the basis for successful research co operations with focus on Europe.

The event is part of the activities of EPoSS, the European Technology Platform on Smart Systems Integration.

Technology - Smaller! Smarter! Integrated!

Smart Systems Integration allows you to form a system out of components which is able to gain information from the environment, to process it electronically, to communicate signals and data and to give enabled feedback signal to the ambience.
The whole system is subject to the trend of today’s world: miniaturization, networking capability, energy-autonomy and reliability. Due to increasing complexity and multidisciplinarity developing teams in fields of microsystems- and nanotechnology, optics, fluidics, biology, medical science, electronics and wireless communication technologies face highest demands.

Scope of the conference

The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modelling, simulation and characterisation of advanced nanoscale silicon and silicon compatible devices in the More Moore, More than Moore and Beyond CMOS domains. Topics  include, but are not limited to:

• Nanometre scale devices: physics, technology, characterisation techniques and evaluation metrics for high performance, low power, low standby power, high frequency and memory applications.
• CMOS scaling perspectives; device / circuit level performance evaluation; switches and memory scaling.
• New channel materials for CMOS electronics: strained Si,  strained SOI, SiGe,  GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devices.
• Thin gate dielectrics: first and second generation high-k materials for switches and memory.
• Alternative transistor architectures including PDSOI, FDSOI, DGSOI, FinFETs, MuGFETs, vertical MOSFET, IMOS and tunnel FET structures. Benchmarking of new architectures w.r.t. bulk CMOS.
• One dimensional and zero dimensional structures: nanowires, nanotubes, nanodots. Nanowire and nanotube based interconnects; nanocrystal based NVM memory cells.
• Variability and fluctuation phenomena in electronic switches and memory devices. Single electron, few electron, discrete dopant and discrete charge effects in scaled electron devices.
• Advanced physics based modelling and simulation of nanoscale switches and memory. First principle and ab-initio modelling of devices, materials and interfaces for CMOS.
• Quasi ballistic, ballistic and quantum transport in nanoscale devices. Compact modelling of nanoscale devices. modelling and management of thermal effects. Benchmarking of modelling approaches.
• Process characterisation through device parameter extraction, device and electrical characterisation of nanometre scale technologies.
• CMOS compatible molecular and quantum devices; non conventional nanodevices for sensors, actuators and bioelectronics. NanoCMOS to bio- and opto-interfaces.

Image Sensors Europe 2010
23 - 25 March 2010
Copthorne Tara Hotel, Kensington, London, UK

Attend SPIE Photonics Europe, a conference focused on a broad range of technologies and their integration into a variety of applications. Broaden your professional network and accelerate your research.

Hear the latest updates in

• Micro/Nano Technologies
• Disruptive Organic and Bio Photonics
• Highly Integrated and Functional Photonic Components
• Advances in Laser and Amplifier Technologies
• Photonics in Industrial Applications

2010 Programme

• 19 Conferences
  Hear the latest from 1,300 presentations
  
  
• Hot Topics in Photonics
  
  • European photonics research strategy
  • optical nanoscopy
  • micromanipulation
  • photonics and computing
  • photonic integration
  • nanophotonics
  • plastic photonics and electronics
  • ultrafast nonlinear optics
  
  
  
• Courses and Workshops
  In-depth training and career enhancement
  
  
• 150-Company Exhibition
  Meet new suppliers from leading companies. Registration for the exhibition is free.
  
  
• Photonics Innovation Village
  Showcasing developments from universities, nonprofits, and research centres

5th Fraunhofer IMS Workshop
CMOS Imaging
Low-Light Imaging

May 4th and 5th, 2010

at Fraunhofer IMS
Finkenstraße 61
47057 Duisburg / Germany

Objectives and Scope
The past CMOS Imaging Workshops were a great success
and were met with very high interest. We want to
continue providing a forum to the European industry and
academia for important themes on technology, design,
and applications of CMOS-based image sensors and
systems as well as facilitate discussions on related topics.

Language
The official language of the workshop is English.

Speakers
We have the pleasure to announce well-known invited
speakers who give comprehensive surveys and interesting
talks on their special fields of interest.

Anton Grabmaier, Fraunhofer IMS, Germany

Holger Vogt, Fraunhofer IMS, Germany

Lindsay Grant, STM, Great Britain

Mark Stanford Robbins, e2v, Great Britain

Franco Zappa, Politecnico di Milano, Italy

Gerhard Lutz, PNSensor, Germany

Albert Theuwissen, Harvest Imaging & Technical University of Delft, The Netherlands

Pierre Magnan, SUPAERO, France

Boyd Fowler, Fairchild Imaging, U.S.A.

Alex Krymski, Alexima, U.S.A.

Guy Meynants, CMOSIS, Belgium

Walter Rütten, Philips, Germany

Werner Brockherde, Fraunhofer IMS, Germany

Ulrich Seger, Robert Bosch, Germany

Sören Hader, Pilz, Germany

Workshop Documentation
A CD-ROM with the contents of the presentations
will be handed out to the participants of the workshop.

Organization
This workshop is organized by the Fraunhofer Institute
of Microelectronic Circuits and Systems, Duisburg,
Germany. The members of the Program Committee are
Prof. Bedrich Hosticka, Ph.D., and Mr. Werner
Brockherde. Workshop secretary is Mrs. Cornelia Metz.

Workshop Venue
The workshop will be held at the Fraunhofer Institute
in Duisburg. The institute is located downtown Duisburg
and can be easily reached either from Duisburg Central
Railway Station or from Duesseldorf International Airport.

Evening Event on May 4th, 2010
A dinner is going to take place at the “Residenz
Uhlenhorst” which is an old historic villa of an industrialist
of the 20th century. The location is situated in the
forest of Mülheim/Ruhr near to the Fraunhofer Institute.

CONTROL 2010: Die Weltleitmesse präsentiert QS-Lösungen mit Zukunft und bietet den Blick über den Tellerrand: 04. – 07. Mai 2010, Neue Messe Stuttgart

Als Schwerpunkte bietet die CONTROL ganz spezielle bereichsübergreifende Informationen in enger Zusammenarbeit mit dem Fraunhofer IPA und der Fraunhofer-Allianz Vision. Das Event-Forum des Fraunhofer IPA befasst sich als branchenorientierte Präsentations-Plattform zur CONTROL mit dem Themenkomplex „Energieeffizienz in der Produktion“. Die Fraunhofer-Allianz Vision präsentiert erneut die Innovations-Sonderschau „Berührungslose Messtechnik“. Ergänzt werden diese Highlights durch das bewährte Aussteller-Forum. Hier erhalten die Fachbesucher alle Informationen, um an der CONTROL zielsichere Investitionsentscheidungen treffen zu können.

 

DIGITAL IMAGING, IMAGE SENSORS, AND CAMERA TECHNOLOGY
May 10-11, 2010. The Moeller Centre, Cambridge, UK

Advanced Course on Image Sensor Technology
TECHNOLOGY FOCUS
Highly sophisticated CMOS image sensors are key components of modern cameras. Technology as well as device architectures are optimized to obtain peak performance of the image sensor and the camera system. The most advanced CMOS image sensors show pixel sizes close to 1 µm. The imagers demonstrate a light sensitivity comparable to that of the human eye.

Another feature, the back-side illumination, is no longer limited to high-end professional applications. In addition, the modern camera systems can present a dynamic range of 100 dB or more. The equivalent noise level is in the range of sub-electron noise. Even if all these incredible features cannot be combined in one single CMOS image sensor simultaneously, they will allow for new technology breakthroughs and new imaging applications.

Furthermore, the image sensor fabrication technology is not yet pushed to its ultimate limits. Image sensors make use of CMOS technologies that are lagging 2 or 3 generations behind those of digital integrated circuits or solid-state memories. Even more interesting developments can thus be expected in the near future. It has still to be proven that imagers can break the 1 µm barrier. Will imagers ever outperform the human eye as far as light sensitivity is concerned?

COURSE CONTENT AND OBJECTIVES
This is an advanced course focussing on the solid-state image sensor technology. It is intended for the specialists in the field. A very good background of digital imaging is needed to get the most out of this course. It can be regarded as a continuation of Course #13 Digital Imaging: Image Capturing Image Sensors, Technologies and Applications. The content is based on comments, suggestions, and remarks received from previous participants in courses #13 and #14 Digital Camera Systems.

Monday
CMOS PIXELS

Pinned Photodiode
What is new in CMOS image sensor pixels after the introduction of the pinned photodiode? The pinning layer created a real breakthrough in CMOS imaging, but does the pixel development stop with the pinned photodiode?

An interesting concept to create very small pixels is the so-called shared pixel architecture, primarily based on pinned photodiodes as well. Advantages and disadvantages of the shared pixels will be discussed.

Global Shutter Pixels
The Rolling Shutter is still an issue in imagers that are being used for instance in broadcast, machine vision, and other applications. What are the alternatives in pixel design to turn the rolling shutter into a global shutter? Pixels with 4, 5, 6 and 7 transistors will be compared to each other.

Wide-Dynamic Range Pixels
Pixels are getting smaller and the specs on dynamic range are becoming tighter. What kind of architectures can be implemented to extend the dynamic range?

Back-Side Illumination
Backside illumination to obtain extremely high quantum efficiencies is becoming very popular. Several fabrication methods will be compared. A crucial part of the technology is the passivation of the backside of the sensors. The background of the passivation issues will be highlighted.

Tuesday
CMOS IMAGER SYSTEMS

Noise on Pixel Level
At present, the pixels and the in-pixel circuitry are the limiting noise factors. From where is the remaining noise coming? What kind of new developments can be expected? Topics such as Transfer Gate noise, RTS noise and 1/f noise will be discussed.

Noise on System Level
Noise can be used as an interesting measurement tool in the so-called Photon Transfer Curve method. Parameters such as conversion gain, dynamic range, saturation level, noise floor, quantum efficiency, PRNU can be deduced. If the method is performed in darkness, dark current levels as well as DRNU can be measured. Further elaboration of the method will explain that this technique is not only a useful measurement tool but a diagnostic tool as well.

Electron Multiplication
In case of extremely low light level, the EM-CCD is a very interesting and powerful image sensor. This device is characterized by the fact that an electron multiplication stage is included just before the output amplifier. In this way a gain can be applied to the signal in the CCD without amplifying the noise of the output stage. Equivalent noise levels of sub-electrons are being reported.

_____________________________________________

Regular Course Fee: EUR 1310

University Student and Faculty Rate:
Two university participants are welcome to attend for one course fee if payment is to be made from university funds.

Deliverables:
The course fee covers tuition, course material, and the day conference packages (morning/afternoon refreshments, lunches etc.) paid on your behalf to the course venue.
Accommodation is not included.

Registration

 

 

Nürnberg, 18. - 20.5.2010
17. Internationale Fachmesse für Sensorik, Mess- und Prüftechnik mit begleitenden Kongressen

Mehr als 20.000 Wissenschaftsbegeisterte aller Altersgruppen strömten am 19. Juni 2009 zum siebten Mal sieben Stunden lang in die Dresdner Hochschulen und Forschungsstätten und flanierten durch Labore und Hörsäle. Und sorgten damit für einen weiteren Besucherrekord. Egal ob Leibniz-, Max-Planck- oder Fraunhofer-Institute, TU Dresden, HTW, Musikhochschule oder Universitätsklinikum – bei allen 29 Veranstaltern der Wissenschaftsnacht zeigte sich in rund 370 Veranstaltungen an 44 verschiedenen Orten das ungebrochene Wissenschaftsinteresse. Schon die kleinsten Besucher im Vorschulalter fragten, staunten und lernten, was in Laboren zischt und getüftelt und in Hörsälen dargeboten wird.

Die 10. OPTATEC empfängt die Fachwelt vom 15. bis 18. Juni 2010 in Frankfurt mit einem deutlich überarbeiteten Angebotsspektrum sowie der speziellen Präsentation von aktuellen / künftigen Brennpunkten der Branche.

524 ausstellende Unternehmen aus 28 Ländern, mehr als 5.500 Fachbesucher – die im Jahr 2008 veranstaltete OPTATEC, Internationale Fachmesse Optischer Technologien, Komponenten, Systeme und Fertigung für die Zukunft, wurde ihrem Ruf als Branchen-Treff mit weltweiter Beteiligung und Beachtung erneut mehr als gerecht. Der einmalige Mix aus anforderungsgerechter Nomenklatur, praxisnaher Branchen-Orientierung sowie international anerkannter Informations-, Kommunikations- und Beschaffungs-Plattform für die Hard- und Software bei der Anwendung Optischer Technologien, wird auch zur 10. OPTATEC vom 15. – 18. Juni 2010 die internationale Fachwelt im Messezentrum Frankfurt zusammenführen.

Die Schlüsseltechnologie der Zukunft präsentiert sich auf der
OPTATEC 2010 – Ausstellungsflächen sind stark gefragt

Knapp 70% der letztmals benötigten Ausstellungsfläche war zum Jahresbeginn 2009 bereits wieder belegt. Dieser Trend wird sich mit Sicherheit fortsetzen, denn die Entwicklung Optischer Technologien schreitet rasant voran und ermöglicht jetzt und in der Zukunft vielfältige Anwendungen in bisher ungeahntem Ausmaß. Für die meisten Optik-, Energie-, Medizin- und Fertigungstechnik-Prozesse nehmen optische Technologien zweifellos eine Schlüsselfunktion ein.

 Mit der Jubiläums-OPTATEC für die Zukunft der Branche gerüstet 

Um die Rolle der OPTATEC als eine führende Branchenplattform auch künftig zu sichern, werden alle Aspekte, Technologien, Produkte, Systeme und Dienstleistungen rund um die optischen Technologien in allen relevanten Bereichen dem technischen Fortschritt angepasst. Bewährtes bleibt erhalten, neue Branchenentwicklungen werden angemessen integriert. 2010 liegt der Fokus auf den Trendthemen Faseroptik, Photovoltaik, Sicherheitstechnik, LED-Technik und Medizintechnik. Ein attraktives Rahmenprogramm vervollständigt die Präsentation.

Detectors and Imaging Devices:
OP217: Infrared Detectors and Focal Plane Arrays XI
Chair(s): Eustace L. Dereniak; John P. Hartke; Paul D. LeVan
Program Committee
Arvind I. D'Souza, DRS Sensors & Targeting Systems, Inc.; Sarath D. Gunapala, Jet Propulsion Lab.; John E. Hubbs, Ball Aerospace & Technologies Corp.; Herbert K. Pollehn, Army Research Lab.; Robert E. Sampson, I-Technology Applications; James A. Stobie, BAE Systems; William B. Weissbard, Teledyne Imaging Sensors

This conference is to cover 2-D Arrays from the visible (NIR) to the longwave infrared spectrum (LWIR). The detection of infrared radiation has proven to be a viable investigative tool in environmental studies and in medical, automotive, and military applications. This conference is directed toward the focal plane component of the infrared sensor system. Progress in charge transfer device technology has been rapid in both linear and two-dimensional arrays, thus continual updates to the optics community are needed. Recent developments in room temperature infrared detectors and system applications have resulted in significant interest in these topics. Various architectures such as monolithic, planar hybrid, and signal conditioning technology have been demonstrated at cryogenic temperatures for higher performance cooled IR FPAs, and therefore are tools available to researchers in various disciplines. Applications of systems containing these technologies are becoming more common, and techniques for extending the utility of these are solicited.

This conference will provide a forum for papers ranging from basic device physics to novel applications. Also there will be sessions featuring Focal Plane Signal Processing Electronics and Readout Electronics, and associated circuitry. Some sessions will emphasize Smart Signal Processing within the Readout Integrated Circuit (ROIC). We are looking for papers that demonstrate state-of-the-art in novel readout structures, on-chip signal processing, and papers that will provide information on newly designed, less expensive digital circuits for fast and ultra fast signal processors on the focal plane array.

Papers are solicited in, but are not limited to, the following areas:
    * infrared detector materials (i.e., InSb, HgCdTe, PtSi, GaAs)
    * infrared FPA (and detector) testing
    * quantum structure detectors (e.g., QWIP, stained layer)
    * smart focal planes
    * diffractive optics on FPA
    * planar hybrid arrays
    * hybrid input circuits
    * infrared sensor systems and characteristics
    * astronomical applications
    * industrial applications
    * automotive applications
    * medical applications
    * imaging spectrometer application
    * imaging polarimeter application
    * FPA data processing
    * cryogenic electronics
    * on-FPA signal processing
    * room temperature detectors
    * ROIC designs
    * smart signal processing
    * readout electronics
    * S/H on-chip
    * A/D converters per pixel, column, and array
    * up/down counter on FPA.

OP218: Infrared Detector Devices and Photoelectronic Imagers V
Chair(s): Randolph E. Longshore; Ashok K. Sood
Program Committee
Raymond S. Balcerak, Raymond S. Balcerak, LLC; Nibir K. Dhar, Army Research Lab.; Paul LoVecchio, BAE Systems; Meimei Z. Tidrow, U.S. Army Night Vision & Electronic Sensors Directorate; Priyalal S. Wijewarnasuriya, Army Research Lab.; Jimmy Xu, Brown Univ.; Sung-Shik Yoo, Northrop Grumman Electronic Systems

This conference will focus on technology achievements in the EO/IR and Photoelectronic detection and imaging and Nanotechnology based EO/IR devices and technology. The various demands for high sensitivity, low noise, improved resolution, higher low-light-level sensitivity, high-speed response, laser eye-safe imaging, and solar blind UV detector arrays, etc., have produced extensive research and development activities for devices and systems to be used for tactical, space science, analytical instrumentation, military, medical, and a host of other applications.

In addition, the conference is intended as a high-level forum bringing together scientists and engineers involved in the research, design, and development of infrared detectors and unique IR device structures including nanotechnology.

Papers are solicited for, but not limited to, the following topics:
    * nano technology based EO/IR detectors
    * nano / micro bolometers
    * detectors on large area substrates
    * HgCdTe on silicon
    * SWIR,MWIR,LWIR detectors
    * quantum well FPAs
    * heterojunction FPAs
    * strained superlattice FPAs
    * type II antimony-based superlattices FPAs
    * commercial applications
    * higher operating temperature detectors
    * avalanche photodiodes
    * very long-wavelength detectors
    * electronic readout image intensifier devices
    * innovative low noise read out circuits
    * CMOS / CCD cameras
    * single and multi-MCP detectors and imagers
    * microchannel plate technology improvements for image intensifiers
    * high-performance photomultiplier tubes
    * advanced microchannel plates
    * advanced fiber optics
    * solar blind imaging systems
    * medical image tube cameras
    * cameras for low-light-level high-definition TV
    * ultraviolet imaging systems
    * photon-counting imaging
    * lidar and ladar imaging
    * image intensifiers for military night vision systems
    * plasmonic IR applications
    * robotic vision
    * unmanned autonomous vehicle cameras
    * undersea imaging.
    * multi spectral systems

 

AMICSA 2010 (5-8 September 2010)

ESA is organizing the Third International Workshop on Analog and Mixed-Signal Integrated Circuits for Space Applications (AMICSA).

The Workshop will be held from September 5 to September 7 in ESTEC, The Netherlands.

This 3rd edition will include tutorials on mixed signal design for space.

The 11th European Conference on Computer Vision (ECCV 2010) will be hosted by the Foundation for Research and Technology-Hellas (FORTH), Crete, Greece from Sunday, 5 September 2010 to Saturday, 11 September 2010:

• Sunday, Sep. 5th: ECCV'2010 Tutorials
• Monday, Sep. 6th - Thursday, Sep. 9th: Main ECCV'2010 Conference
• Friday, Sep. 10th - Saturday, Sep. 11th: ECCV'2010 Workshops

Toulouse, France 20 - 23.09 2010
Centre de Congrès Pierre Baudis

SPIE Remote Sensing is the premier European meeting focused on the latest developments in remote sensing, including next-generation satellites, SAR image analysis, and LIDAR technologies.

Cologne Germany 21.9. - 26.9.2010
Koelnmesse
world of imaging
Die Weltleitmesse für Foto und Imaging

Held at the Parc Floral on the Esplanade du Château Vincennes in Paris, PRI - PHOTON Research Industry 2010 is the event where you will meet optics photonics leaders, forge new relationships and build your business.

This year, PRI unites OPTO (October 26-28, 2010), the European tradeshow dedicated to all optics-photonics solutions, with the annual meetings of the European Optical Société (EOS) and the CNOP (National Committee on Optics and Photonics) as well as special activities including the celebration of the laser's 50th anniversary and the awards ceremony for La Vitrine de l'Innovation.

The 7th China International Machine Vision Exhibition and Machine Vision Technology & Application Conference (VisionChina2010) will be held on October 27-29, 2010 at China International Exhibition Center, Beijing, China. Jointly organized by Machine Vision Professional Committee under China Society of Image and Graphics and CIEC Exhibition Co., Ltd., VisionChina2010 will serve as an efficient platform for showcasing latest machine vision products and technology as well as conducting trade exchanges.

Around 100 exhibiting companies from 9 countries and regions participated in VisionChina2009, namely the United States, Germany, Japan, Singapore, Korea, Malaysia, Finland, China and Hong Kong SAR of China. The exhibiting space reached 3500 square meters. 726 registered professionals and end-users attended the conference in 21 sessions. The three-day exhibition attracted 6342 trade visitors from China, Hong Kong, Taiwan, the United States, Korea, Japan, Australia, German, Singapore, Thailand, India，Israel and Lebanon etc.

OPTO technical program

• Optoelectronic Materials and Devices
• Photonic Integration
• Nanotechnologies in Photonics
• Advanced Quantum and Optoelectronic Applications
• Semiconductor Lasers and LEDS
• Displays and Holography
• Optical Communications: Devices to Systems
• NEW for 2011: Green Photonics Virtual Symposium

2011 Symposium Chair:

Liang-Chy Chien Kent State Univ. (United States)

2011 Symposium Cochairs:

Klaus P. Streubel, OSRAM GmbH (Germany)
E. Fred Schubert Rensselaer Polytechnic Institute (United States)

2011 Program Track Chairs:

Optoelectronic Materials and Devices
James G. Grote, Air Force Research Lab. (United States)

Photonic Integration
Yakov Sidorin, Quarles Brady LLP (United States)

Nanotechnologies in Photonics
Ali Adibi, Georgia Institute of Technology (United States)

Advanced Quantum and Optoelectronic Applications
Zameer U. Hasan, Temple Univ. (United States)

Semiconductor Lasers and LEDS
Klaus P. Streubel, OSRAM GmbH (Germany)

Displays and Holography
Liang-Chy Chien, Kent State Univ. (United States)

Optical Communications: Devices to Systems
Benjamin Dingel, Nasfine Photonics, Inc. (United States)

 

Organization

Conference Chair
Martin Walther
Fraunhofer Institute for Applied Solid-State Physics (IAF), Germany

Organization
Volker Daumer, Heidrun Schwörer, Martin Walther

Markus-Christian Amann Technical University Munich

Peter N. J. Dennis QinetiQ, Malvern

Gerard Destefanis CEA-LETI, Grenoble

Lorenzo Faraone University of Western Australia, Crawley

Chris Grein EPIR Technologies, Bolingbrook

Anton Kaltenecker EADS, Unterschleißheim

Marcel Rattunde Fraunhofer-IAF, Freiburg

Robert Rehm Fraunhofer-IAF, Freiburg

Antoni Rogalski Military University of Technology, Warsaw

Hans-Dieter Tholl Diehl BGT, Überlingen

Eric Tournie University Montpellier

Johann Ziegler AIM Infrarot-Module GmbH, Heilbronn

Announcing the New Show for the Highest Concentration of Manufacturing in the UK

 For much of the past 150 years the West Midlands has been a powerhouse of British industry and commerce. It was the cradle of the Industrial Revolution and more recently the birthplace of the jet engine’s inventor, Sir Frank Whittle. These days, the region is reckoned to contribute about £85 billion per year to the national economy.

Co-located with MEDTEC UK and Mtec 2011, shows that are already delivering over 3,500 key design and manufacturing engineers and decision makers across two days, the Midlands Design and Manufacturingshow is the new annual trade exhibition devoted to engineering and manufacturing in the Midlands region. Exhibitors supply the British manufacturing industry with technology and services such as automation equipment, vision systems, subcontract manufacturing services, CNC and EDM Machining Centres, Leak testing equipment, vacuum technologies, electronic components.

 

Midlands Design and Manufacturing provides the platform to exhibitors to liaise face to face with the UK’s main manufactures from a variety of vertical markets, including Aerospace, Medical, Automotive, Defence, Rail and Telecommunications markets. Last year over £110 Million of quotes were tendered at the combined events, as attendees here have the chance get hands on with the offered products and services.

MSS Specialty Group on Detectors
The MSS Specialty Group on Detectors is a SECRET level classified forum for the presentation, discussion, and dissemination of information on detector technology. It covers the electromagnetic spectrum from x-rays through terahertz. The group addresses all aspects of detector technology including detection phenomena, the physics of ideal and real detectors, advanced material growth technology, and the chemistry of detector fabrication processes. This meeting covers the reliability and survivability of detectors including nuclear hardness. Also of interest are the electronics and signal processing associated with focal plane image formation such as readout circuit technology, on-focal-plane signal processing, and non-uniformity correction. Detector technologies of interest include discrete detectors, scanning and staring focal plane arrays, photon and thermal detectors, coherent and incoherent detectors, and wavelength converters.

MSS Specialty Group on Materials
The MSS Specialty Group on Materials provides a SECRET level classified forum for the presentation, discussion, and dissemination of information within the defense community on the exploration, development, and utilization of materials to be used in military optical and electro-optical devices and systems operating in the optical (UV to mm wave) spectrum. Subjects include materials for detectors and substrates, optical windows and other optical elements, filters, optical techniques such as diffractive and binary optics and rugates, meta-materials, and other materials issues that enable the development of optical and electro-optical sensors, etc.

Correlaton of Material Properties/Defect Structures with Device Performance Detectors for Space Applications Detectors and FPAs for Active Receiver Systems Multicolor, Hyperspectral and Polarization-Sensitive Detectors New and Engineered Materials Optical Materials for Improved System Performance Smart FPAs and Advanced Readout Circuit Technology Strained Layer Superlattice Detector Technology Joint Session - Uncooled IR Detector and FPA Technology Joint Session - Large Area Substrates Joint Session - Advanced Multi-Layer Detector Structures for IRFPA's Advanced Detector Technology Characterization and Modeling of Materials, Processing and Evaluation Techniques for Improved Device Performance

Robin Finey robin.finey@dlpe.gatech.edu Phone: (404) 407-7381 Fax: (404) 407-9924

Praxisnahe Einblicke in CMOS Sensoren

---

Mit dem weltbekannten Bildverarbeitungs-Experten Dr. Albert Theuwissen.

CMOS Bild-Sensoren finden ihren Einsatz sowohl im Endverbraucher- als auch im Profibereich. Und auf Dauer werden CMOS Sensoren in der Anwendung immer gefragter. Das heißt, immer mehr Ingenieure werden mit dieser Entwicklung konfrontiert werden.
Diese Schulung ist dafür konzipiert, offene Fragen im Bereich CMOS Sensortechnik und deren Vor- und Nachteile zu diskutieren. Das zweitägige Training wird von dem Bildverarbeitungs-Experten Dr. Albert Theuwissen in Englisch gehalten. Nach einer kurzen Einleitung zu dem Thema konzentriert sich der Kurs auf die Einsetzbarkeit von CMOS Sensoren, als auch auf die Erläuterung der Pixelstruktur. Hauptfrage ist, was mit diesen Pixeln machbar ist und wo die Grenzen dieser Machbarkeit liegen?
Außerdem werden die generellen Charakteristika der Bildsensoren besprochen, wie Dunkelstrom, Anti-Blooming, Global-shutter, Rolling-shutter, Störereignisse und zeitlichen Rauscharten. Zum Schluss werden anhand eines praktischen Beispiels die Spezifikationen analysiert. Um die Schulung so interaktiv wie möglich zu gestalten, können die Teilnehmer auch gerne ihre eigenen Sensor-Spezifikationen mitbringen und in der Gruppe diskutieren.

Dr. Albert Theuwissen ist Autor des Buchs „Solid-State Imaging with Charge-Coupled Devices“, die maßgebliche Lektüre im Bereich Solid-State Imaging. In März 2001 bekam er die Part-time Professur an der Delft Universtät für Technologie in den Niederlanden übertragen, wo er hauptsächlich PhD Studenten bei den wissenschaftlichen Arbeiten zu CMOS Sensoren unterstützte. In April 2002 wurde Dr. Theuwissen CTO der DALSA Corp., um dann seinen Aufgabengebiet als Chief Scientist zu erweitern. Im September 2007 verließ er die DALSA Corp. und gründete die Harvest Imaging, die Schulungen, Coachings und Unterrichte im Solid-State Imaging Bereich anbietet. In 2008 erhielt Dr. Theuwissen die SMPTE (Society for Motion Pictures and Television Engineers) Fuij Goldmedaille für seinen einzigartigen Beitrag zur Forschung, Entwicklung und Fortbildung im Bereich Solid-State Bildverarbeitung.

Detaillierte Informationen zu dieser Schulung finden Sie hier.

Schulungsziele
· Überblick über Möglichkeiten, Grenzen und Optimierung von CMOS Sensoren
· Darstellung  von Charakteristika der Bildsensoren, wie Dunkelstrom, Anti-Blooming, Global-shutter, Rolling-shutter, Störereig-
  nisse und zeitlichen Rauscharten
· Praktische Beispiel der Sensor-Spezifikationen und Lösungsstrategien für die Praxis

Zielgruppe
Techniker, Facharbeiter und Ingenieure, die CMOS Sensoren nutzen und mehr Informationen benötigen, um systematisch und zielgerichtet bei Einsatzbereich, Fehlersuche und Optimierung vorzugehen.

Kosten
1390,00 EUR (zzgl. MwSt.) pro Person, inkl. Tagungsgetränke, Mittagessen und Schulungsunterlagen.  

Termin und Ort
09.-10. Februar 2011
FRAMOS Office Pullach: Zugspitzstr. 5C, 82049 Pullach b. München

Wir bitten Sie, sich bei Interesse so schnell wie möglich, spätestens aber bis Donnerstag, den 20. Januar 2011 verbindlich für das Seminar anzumelden.

1st EUCDE conference  announcement

http://www.nde-information.eu/

 

2011
March 14-16, Avignon (France), First EU Conference on the Detection of Explosives.

1st EUCDE Announcement.
 
The first EU Conference on the Detection of Explosives will take place in Avignon in March 14 - 16, 2011.
All news on this event will be available on the forthcoming website of the conference where you will find the first circular.
The main goal of the conference is to evaluate the progress and future needs in the area of detection of explosives.
The conference topic is to bring up new ideas and developments in the field and initiate networking activities.
The EUCDE conference is dedicated to scientists, industrials and end-users.
EUCDE is supported by the European Commission.

Bulk detection
• Liquid explosive detection
• Trace detection
• Stand-off detection
• Body scanners
• Properties of explosives
• Trialing, certification
• Sensor fusion and integration

PHOTONICA 2011 brings together developers, suppliers and consumers of laser and optics.
A wide international participation in the exhibition makes it really representative, and fully demonstrates the current development trends for laser and optical technology.
 
PHOTONICA 2011 is a leading exhibition event of the Russian laser and optical industry.
 
No other event showcases the entire spectrum of laser, optical and optoelectronic technologies like PHOTONICA 2011 does.

 

VENUE
Expocentre Fairgrounds, Moscow / Russia
 
10:00 am – 06:00 pm

• EXPOCENTRE Fairgrounds, Moscow

            www.photonics-expo.ru

• Laser Association

IMAG - Internationaler Messe- und Ausstellungsdienst GmbH
Exhibition Director: Ms. Viola Baumgärtner
Tel.: + (49) 89 9 49 22-337 - Fax: + (49) 89 9 49 22-350
Email: photonica@imag.de
www.imag.de; www.imag-standdesign.com

Sensor Systems and Platforms
•	IR, Radar, Passive Millimeter-wave, and Terahertz Imaging and Spectroscopy
•	CBRNE
•	Persistent ISR
•	Acquisition and Tracking
•	C3I
•	Energy Harvesting
•	Biometric
•	Laser Sensors and Systems
•	Micro-Nanosensors
•	Biomimetics
•	Unmanned, Robotic, and Layered Systems
•	Displays
•	Space Technologies and Operations
•	Sensors including Fiber Optics
•	Wireless Sensing
•	Scanning Microscopy - NEW Sensor and Data Analysis  • Image and Data Processing  • Visual Analytics  • Information Fusion  • Target and Pattern Recognition  • Synthetic Aperture and Vision Algorithms  • Multi, Hyper and Ultra Spectral Analysis  • Situational Awareness  • Information and Sensor Systems and Networks  • Global Health Technologies - NEW

Present a Technical Paper:

•	Design for manufacturing
•	Materials and optical material sciences
•	Classical and automated fabrication
•	Grinding, polishing, and new methods of surface finishing
•	Process sciences
•	Coatings technology
•	Metrology
•	Opto-mechanical design and fabrication
•	Interactivity and data interfaces
•	Injection molding, glass molding, lithographic processing and chemical etching

Present a Commercial Paper:

•	New developments in Optical materials
•	New infrared materials
•	Advanced optical fabrication equipment
•	Coating equipment
•	Metrology equipment Conference Cochair James J. Kumler, JENOPTIK Optical Systems (USA)

Vom Sensor bis zur Auswertung:
Die gesamte messtechnische Systemkompetenz
für die Mess-, Prüf- und Überwachungsaufgaben aller Branchen

2011 International Image Sensor Workshop (IISW)
Japan June 2011

General Workshop Co-Chairs:

Nobakazu Teranishi / Panasonic

Junichi Nakamura / Aptina Imaging

Technical Program Chair:
Shoji Kawahito / Shizuoka University

Steering Committee:

Eric R. Fossum / Samsung Semiconductor R&D Center

Nobukazu Teranishi / Panasonic

Albert Theuwissen / Harvest Imaging & Delft Univ. of Technology

Detectors and Imaging Devices:

•	Infrared Detectors and Focal Plane Arrays
•	Infrared Detector Devices and Photoelectronic Imagers

Photonic Applications:

•	Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications
•	Tenth International Conference on Solid State Lighting 2010 Photonic Devices + Applications Symposium Chair Zakya Kafafi, National Science Foundation (USA)

The International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), is the oldest and largest continuous forum devoted to the science and technology of long-wavelength radiation. The scope of the conference includes all scientific and technological activities which involve the long-wavelength region of the electromagnetic spectrum. This covers a very wide range of disciplines, encompassing everything from micro- and nano-scale structures to large-scale accelerators and tokamaks and their applications. Presentations at this conference may address issues ranging from basic physics, chemistry, and materials science to applications in energy, communications, imaging, and more.