San Jose, California, USA  17 - 21  Januray 2010

The best global audience for imaging systems, instrumentation, 3D, and image processing

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Wednesday: Image Sensors

Thursday: High Speed Image Capture Technologies

Microelectronic Presentation Days (03-04/2010) - ESTEC

Preliminary Agenda

SMART SYSTEMS INTEGRATION - die internationale Kommunikationsplattform für Industrie und Forschungsinstitute dient dem Wissenstransfer zum Thema Smart Systems Integration. Die Veranstaltung schafft die Basis für erfolgreiche Forschungskooperationen mit Schwerpunkt Europa.

Die Veranstaltung ist Teil der Aktivitäten von EPoSS, European Technology Platform on Smart Systems Integration.

Technologie - Kleiner! Komplexer! Intelligenter!

Durch Smart Systems Integration entsteht aus verschiedenen Einzelkomponenten ein System, das über Sensorik Informationen aus der Umwelt gewinnt, diese mittels Elektronik verarbeitet, Signale und Daten kommuniziert und aktive Rückmeldung an die Umgebung leisten kann.
Zunehmende Komplexität und Interdisziplinarität stellen höchste Ansprüche an die Entwicklerteams, die sich auf den Gebieten Mikrosystem- und Nanotechnik, Optik, Fluidik, Biologie, Medizin, Elektronik und kabellose Kommunikationstechnik bewegen müssen.

SMART SYSTEMS INTEGRATION is the international communication platform for research institutes and manufacturer to exchange know-how on smart systems integration and to create the basis for successful research co operations with focus on Europe.

The event is part of the activities of EPoSS, the European Technology Platform on Smart Systems Integration.

Technology - Smaller! Smarter! Integrated!

Smart Systems Integration allows you to form a system out of components which is able to gain information from the environment, to process it electronically, to communicate signals and data and to give enabled feedback signal to the ambience.
The whole system is subject to the trend of today’s world: miniaturization, networking capability, energy-autonomy and reliability. Due to increasing complexity and multidisciplinarity developing teams in fields of microsystems- and nanotechnology, optics, fluidics, biology, medical science, electronics and wireless communication technologies face highest demands.

Scope of the conference

The aim of the ULIS Conference is to provide an open forum for the presentation and discussion of recent research in technology, physics, modelling, simulation and characterisation of advanced nanoscale silicon and silicon compatible devices in the More Moore, More than Moore and Beyond CMOS domains. Topics  include, but are not limited to:

• Nanometre scale devices: physics, technology, characterisation techniques and evaluation metrics for high performance, low power, low standby power, high frequency and memory applications.
• CMOS scaling perspectives; device / circuit level performance evaluation; switches and memory scaling.
• New channel materials for CMOS electronics: strained Si,  strained SOI, SiGe,  GOI, III-V and high mobility materials for MOSFET; carbon based electronics; carbon nanotubes; graphene based devices.
• Thin gate dielectrics: first and second generation high-k materials for switches and memory.
• Alternative transistor architectures including PDSOI, FDSOI, DGSOI, FinFETs, MuGFETs, vertical MOSFET, IMOS and tunnel FET structures. Benchmarking of new architectures w.r.t. bulk CMOS.
• One dimensional and zero dimensional structures: nanowires, nanotubes, nanodots. Nanowire and nanotube based interconnects; nanocrystal based NVM memory cells.
• Variability and fluctuation phenomena in electronic switches and memory devices. Single electron, few electron, discrete dopant and discrete charge effects in scaled electron devices.
• Advanced physics based modelling and simulation of nanoscale switches and memory. First principle and ab-initio modelling of devices, materials and interfaces for CMOS.
• Quasi ballistic, ballistic and quantum transport in nanoscale devices. Compact modelling of nanoscale devices. modelling and management of thermal effects. Benchmarking of modelling approaches.
• Process characterisation through device parameter extraction, device and electrical characterisation of nanometre scale technologies.
• CMOS compatible molecular and quantum devices; non conventional nanodevices for sensors, actuators and bioelectronics. NanoCMOS to bio- and opto-interfaces.

Image Sensors Europe 2010
23 - 25 March 2010
Copthorne Tara Hotel, Kensington, London, UK

Attend SPIE Photonics Europe, a conference focused on a broad range of technologies and their integration into a variety of applications. Broaden your professional network and accelerate your research.

Hear the latest updates in

• Micro/Nano Technologies
• Disruptive Organic and Bio Photonics
• Highly Integrated and Functional Photonic Components
• Advances in Laser and Amplifier Technologies
• Photonics in Industrial Applications

2010 Programme

• 19 Conferences
  Hear the latest from 1,300 presentations
  
  
• Hot Topics in Photonics
  
  • European photonics research strategy
  • optical nanoscopy
  • micromanipulation
  • photonics and computing
  • photonic integration
  • nanophotonics
  • plastic photonics and electronics
  • ultrafast nonlinear optics
  
  
  
• Courses and Workshops
  In-depth training and career enhancement
  
  
• 150-Company Exhibition
  Meet new suppliers from leading companies. Registration for the exhibition is free.
  
  
• Photonics Innovation Village
  Showcasing developments from universities, nonprofits, and research centres